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Available Services

TF-AMD Penang is Flip Chip power house that offers various packages of  Assembly & Test of Flip Chip Packages (FCP) including FCBGA, FCPGA & FCLGA.


The factory offers WLCSP Back End Services, Wafer Backgrind (WBG), Die Prep Services(DPS), QFN Test and Wafer Sort.


Flip Chip Packages that the factory assemble and test are for Micro Processor, Graphic Processor, Communication & Set Top Box application. Flip Chip package types cover Single Die Package, Multi Chip Module (MCM), Coreless Substrate Package, Bare Die Package (Lidless Package), Lidded or Heat Spreader Package and Stiffener Package.

(+604) 252 2000



TF AMD Microelectronics (Penang) Sdn. Bhd 

(formerly known as Advanced Micro Devices Export Sdn.Bhd.)

Phase III, Free Industrial Zone,

Bayan Lepas 11900, Penang, Malaysia.


EMAIL : inquiry@tf-amd.com

Copyright©2019 by TF AMD Microelectronics (Penang) Sdn.Bhd. All Rights Reserved.