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Available Services

TF-AMD Penang is Flip Chip power house that offers various packages of Assembly and Test including FCBGA, FCPGA & FCLGA.


We are advanced technology factory with world class team, advanced infrastructure and automation capabilities.


We offer Flip Chip assembly and test services for Micro Processor, Graphic Processors, Communication & Set Top Box application. Flip Chip package types cover Single Die Package, Multi-chip Module (MCM), Coreless Substrate Package, Bare Die Package (Lidless Package), Lidded or Heat Spreader Packager and Stiffener Package.

(+604) 252 2000



TF AMD Microelectronics (Penang) Sdn. Bhd 

(formerly known as Advanced Micro Devices Export Sdn.Bhd.)

Phase III, Free Industrial Zone,

Bayan Lepas 11900, Penang, Malaysia.


EMAIL : inquiry@tf-amd.com

Copyright©2019 by TF AMD Microelectronics (Penang) Sdn.Bhd. All Rights Reserved.