Job Descriptions:
▪ Able to work independently handling WLCSP, Flip-chip PKG assembly including project managing with any related Flip-chip customer.
▪ Responsible to stabilize & develop large die Flip Chip BGA, Hybrid Flip Chip, System-in-Packages.
▪ Able to execute independently BOM (Bill of Material) project for Flip-chip product & such as Underfill, Flux, TIM, Adhesive, Solder ball, etc.
▪ Drive & manage NPI & LVM Product yield to achieve target goal and quality excursion prevention.
▪ Able to work intensively relating to Project Management or NPI and Design for Manufacturing (DFM).
▪ Able to execute project management related with manufacturing systemic like as MES, SAP.
▪ Leading projects to implement new technology realization by setting up project framework, team formation, initiate budgets, communication and milestone/cost tracking.
▪ Manage the development of assembly equipment infrastructure and solutions to meet the new production needs of the company.
▪ Lead and liaise with internal customer to plan, execute and result review on engineering activities for product bring up.
▪ Accountable in overseeing (End to end) and provide direction to entire execution of the project technically.
▪ To conduct technical feasibility check, define criticalness correlate to customer special requirement and bridging solutions accordingly.
▪ Drive individual engineering team on qualification of equipment for product bring up.
▪ Work with various process and equipment team in defining the new product requirement and support customer technical request.
▪ Drive cross function team in project initiating, planning, monitoring and execution to meets project scope in term on cost, timeline and quality requirement.
▪ Provide update in various forum to keep stakeholder aware of latest development status on the new product bring up.
▪ Communicates with team member so that all goals, expectations and performance as compared to plan are well understood.
▪ Research the advance packaging technology roadmap and understand feasibility.
▪ Provide forecast and manage budget requirement for the new product bring up.
▪ Support production as needed on yield improvement and cost reduction.

Job Requirements:
▪ Bachelor’s degree in engineering with min. 10 years of relevant industry, and more than 10 years managing and leading the department/ team.
▪ Must have Flip-chip PKG assembly experience including project managing for Flip-chip customer.
▪ Knowledge of BOM (Bill of Material) for Flip-chip product & such as Underfill, Flux, TIM, Adhesive, Solder ball, etc.
▪ Knowledge and experience in advanced package stabilization & development for more than 16 years including large die Flip Chip BGA, Hybrid Flip Chip, System-in-Packages, etc.
▪ Good contact window with Korean equipment matter and supplier for Flip-chip product.
▪ Candidate with Project Management skill or NPI background would be a distinct advantage.
▪ Strong in planning, ability of statistic analytical skill and systematic problem solving skill.
▪ Extensive understanding/knowledge on manufacturing systemic like as MES, SAP.
▪ Work independently and good communication / interpersonal skill to liaise with cross function department.
▪ Prefer good attitude, work ethic and fast learner candidate.
▪ Understanding and application of broad range of Industrial Engineering knowledge and tools (eg: work measurement, process mapping, facilities, AutoCAD, statistical tools).
▪ Applicants must be willing to work in Bayan Lepas.


For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities

Develop, drive the packaging and technology roadmap that meet future business/customer requirements and increase the organization’s competitive position

Able to work independently to explore, research, develop new packaging/assembly technology that meeting the package roadmap and responsible to establish the processes.

Able to work intensively relating to Project Management and Design For Manufacturing (DFM) and Design For Reliability (DFR).

Manage the development of assembly equipment infrastructure and solutions to meet the new production needs of the company.

Lead and liaise with internal customers to plan, execute, and review the result on engineering activities for product bring up.

Drive individual engineering team on qualification of equipment for product bring up

Work with various process and equipment team in defining the new product requirement and support customer technical request.

Train, develop and retain team member with at least one back up for each critical position

Job Requirements

Bachelor’s/Master degree in engineering with min. 7 years of relevant industry, and more than 5 years managing and leading the department/ team.

Advanced IC Packaging assembly experience and FCBGA including project managing for customer will be added advantage.

Vast experience of in depth knowledge on leading edge advanced packaging equipment/tool.

Candidate with Project Management NPI/ Lid attach/ Stiffener Dispensing / Indium / TIM line background would be a distinct advantage.

Strong in planning, ability of statistic analytical skill and systematic problem solving skill.

Work independently and good communication / interpersonal skill to liaise with cross function department.

Prefer good attitude, work ethic and fast learner candidate.

Job Descriptions:
▪ Management of product sustaining activities which include driving product performance improvement (yield, test time, quality, etc.) and cost reduction.
▪ Manage the introduction of new products and their ramp to volume manufacturing.
▪ Manage the engineering activities during new product development including product definition, performance characterization, qualification, and release to production.
▪ Manage product ramp to yield entitlement. Drive all margin issues with operations and development teams.
▪ Work with the Manufacturing, Design, Quality, and Failure Analysis teams in the disposition of product excursions and manage cases through a material review board.
▪ Train, develop and retain Jr. Engineer.
▪ Other duties as assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Computer/Telecommunication), Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent.
▪ Required Skill(s): Yield Intergration, Wafer Process, WLCSP, FCBGA.
▪ Preferably Junior Executive specialized in Engineering - Electrical or equivalent.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Descriptions:
▪ Explore and development new/ advanced material, process and equipment in FCBGA/ FCLGA/ FCPGA/ FCCSP in multiple chip package and 3D package.
▪ Support product/product NPI in feasibility, characterization and qualification.
▪ Managed to conduct DOE and optimization for evaluation study.
▪ Initiate/implement continuous improvement projects, process optimization and characterization for continual improvement.
▪ Drive yield, quality and productivity improvement program.
▪ Drive investigation, root cause/failure analysis for internal and external quality escapee issues in 4D/ 8D approach.
▪ Update and generate documentation for process-related changes.
▪ System and machine basic troubleshooting.
▪ Drive process cost saving and simplification projects.
▪ Any other duties assigned from time to time.

Job Requirements:
▪ Candidate must possess at least a Bachelor's Degree, Post Graduate Diploma, Professional Degree, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
▪ At least 3-5 year(s) of working experience in the related field is required for this position.
▪ Preferably Senior Executives specializing in Engineering - Process / Product Development.
▪ Advantages if knowledge in LSS GB/ BB, JMP, Minitab, FMEA and AutoCAD.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Descriptions:
• Work intensively relating to Project Management and Design for Manufacturing (DFM) and Design for Reliability (DFR).
• Responsible to work the full life-cycle of projects from idea generation through deployment and optimize the full release value stream.
• Leading projects to implement new technology realization by setting up project framework, team formation, initiate budgets process cost saving, simplification projects, communication, and milestone/cost tracking.
• Explore and development new/ advanced material, process and equipment in FCBGA/ FCLGA/ FCPGA/ FCCSP in multiple chip package and 3D package.
• Support product/product NPI in feasibility, characterization and qualification.
• Managed to conduct DOE and optimization for evaluation study.
• Initiate/implement continuous improvement projects, process optimization and characterization for continual improvement.
• Drive yield, quality and productivity improvement program.
• Drive investigation, root cause/failure analysis for internal and external quality escapee issues in 4D/ 8D approach.
• Update and generate documentation for process-related changes.
• System and machine basic troubleshooting.
• Any other duties assigned from time to time.

Job Requirements:
• Candidate must possess at least a Bachelor's Degree, Post Graduate Diploma, Professional Degree, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
• At least 5 year(s) of working experience in the related field is required for this position.
• Preferably Senior Executives specializing in Engineering - Process / Product Development
• Advantages if knowledge in LSS GB/ BB, JMP, Minitab, FMEA and AutoCAD.
• Managing the full spectrum of the product project.

Job Description :
▪ Lead in project management and ensure all requirements in development or improvement of equipment for processor functional tests are met.
▪ Ensure equipment operation procedures and maintenance programs are in place and achieve equipment availability >90%.
▪ Drive improvements, initiate problem solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities and higher efficiency.
▪ Ensure timely execution of new product or process development and qualification. Demonstrates discipline in timely execution of tasks.
▪ Ensure training and troubleshooting programs on equipment and hardware are in place.
▪ Ensure all requirements are met for smooth equipment implementation in production.
▪ Ensure expectations on production yield, quality, utilization and cost reduction are met consistently.
▪ Lead, train and manage a team of equipment / engineering personnel. Enable and manage engineering change control activities.
▪ Work closely with other groups and sites to provide effective solutions and support for daily production activities. Demonstrates flexibility/adaptability to frequent changes.
▪ Other duties assigned by supervisor/manager.

Job Requirements:
▪ 3-7 years’ industrial experience with 2-5 years equipment development or equipment maintenance experience for EOL processes such as Underfill, Flux cleaning, Ball attach, Stiffener Attach and Tape and Reel.
▪ Diploma/Professional Degree in any fields.
▪ Preferably Junior Executive specialized in Engineering - Electrical or equivalent.
▪ Knowledge in FMEA, SPC, DOE, 8D, Lean Six Sigma will be added advantage.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibility

Explore and development new/ advanced material, process and equipment in FCBGA/ FCLGA/ FCPGA/ FCCSP in multiple chip package and 3D package.
Managing process in ball mount/ Laser Mark/ VM/ ICOS.
Support product/product NPI in feasibility, characterization and qualification.
Managed to conduct DOE and optimization for evaluation study.
Initiate/implement continuous improvement projects, process optimization and characterization for continual improvement.
Drive yield, quality and productivity improvement program.
Drive investigation, root cause/failure analysis for internal and external quality escapee issues in 4D/ 8D approach.
Update and generate documentation for process-related changes.
System and machine basic troubleshooting.
Drive process cost saving and simplification projects
Any other duties assigned from time to time.
Requirements:

Candidate must possess at least a Bachelor's Degree in Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
At least 5 years of working experience in Assembly process.
Preferably Senior Executives specializing in Engineering - Process / Product Development

Job Responsibility

Install, configure, operate and maintain various systems hardware/software and related infrastructure.
Install and maintain security patches of the systems on a regular basis.
Monitor and focus on stability, health and performance of the system, continuously work on improvement.
Responsible for Linux server and testers, production application release and perform troubleshooting.
Perform daily backups, ensuring all file systems and data are successfully backup.
Perform file archival and purging as necessary.
Configuration, support, and maintenance/management of switches and firewall
Responsible for ftp, sftp and all file transfer related activities with customers
Responsible for storage and share folder management
Setup, maintain and monitoring all vital network components as well as determine/recommend future needs, upgrades and expansions.
User account management; create, change and delete as per request.
Other duties as assigned by supervisor.
Job Requirement

Bachelor degree in Computer Science or related discipline.
At least 7 years in depth experience for this position.
Hands-on experience with database standards and end user applications
Experience with various Linux operation systems
Familiarity with load balancing, and firewalls
Experience with Linux testers support in production environment
Additional relevant certifications is an added advantage.
Understand cross-cultural working environments.
Good analytical thinker with attention to details.
Strong problem solving and triaging skills.
Good understanding of support process and change management.
Able to perform work independently with minimum supervision.
Strong problem solving and communication skills

Job Description :
▪ In charge of whole Factory layout, able to draw using AuoCad software.
▪ Capacity planning in order to meet the AOP and maximize plant utilization.
▪ Time study & time standards: Performed time study analysis and continuous improvement based on lean concept.
▪ Productivity improvement project: Lead in cost saving projects such as Manning Ratio, productivity, etc in order to meet company goals.
▪ Resource optimization: manpower allocation for each process, OT allocation, hiring ratio requirements.
▪ Theoretical Cycle Time establishment.
▪ Capital Expenditure (CapEx) planning and proposal.
▪ NPI resource & capacity planning.
▪ Lead and train Junior IE.
▪ Project management: Involved in KPI goal settings such as output target, human efficiency rate, yield, cost and provided to Finance and HR departments on monthly basis.
▪ Other duties as assigned by supervisor.

Job Requirements:
▪ Bachelor’s/Master’s Degree in Engineering (Industrial/Manufacturing/Engineering).
▪ Good oral and written skills in English.
▪ Expert in using AutoCad software to draw layout.
▪ Good Industrial engineering knowledge including Plant layout/Ergonomics/Operations research/Capacity planning/Methods engineering/Work measurement and techniques/Simulation / operational modeling/Facilities operations.
▪ Independent, resourceful and takes initiative.
▪Effective communication skills.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Descriptions:
▪ Assist factory Statistical Process Control (SPC) System implementation including lead SPC Review Forum, conduct SPC Audit, review & maintain electronic SPC system.
▪ Assist factory Measurement System Analysis (MSA) implementation.
▪ Educate and train associates on Lean Six Sigma tools and methodologies, conduct basic SPC & MSA training, project coaching.
▪ Possess knowledge in Lean Six Sigma DMAIC Methodology, Statistical Process Control (SPC), Measurement System Analysis (MSA), Quality Control Circle (QCC), Design of Experiments (DOE).
▪ Candidate with Flip Chip Assembly knowledge and Six Sigma Green Belt will be an added advantage.
▪ Any other related tasks that may be assigned by superior as deemed appropriate.

Job Requirements:
▪ Possess at least a Bachelor Degree in Science, Statistics, Mathematic, Engineering, or equivalent.
▪ Experience Required: at least 5 Years of working experience in the related field is required for this position.
▪ Monitor identified problems and to formulate corrective action with team.
▪ Computer proficient: Minitab Software, Microsoft Excel & PowerPoint.
▪ Other Essential Abilities and Skills: Excellent written & verbal communication.
▪ Plan, organize and direct his/her staff to achieve the plant and QA objectives.
▪ Review reports and documentation for completeness and accuracy.
▪ Participate in audit activities.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities

Monitor and analyze test/product/yield/silicon performance, execute implementation schedules and product data management

Production issue disposition (low yield/OS/Quality issues and etc.)

DTS/ FTR/Product quality and process improvements

Perform test program validation, production release and yield monitoring for new release test program.

Execute engineering activities during new product introduction including product test flow, EVT and DVT engineering activities, generation of buyoff units, and test program readiness before ramping to volume manufacturing.

Other duties as assigned by supervisor.

Job Qualifications

Education: Bachelor’s degree in Electrical and Electronic Engineering or equivalent

Language: Good Oral and written skills in English and Bahasa Malaysia

Experience: Must have experienced (at least 3 - 5years) in relevant industrial experience.

Job Responsibilities:
▪ To provide technical expertise in maximizing overall equipment effectiveness.
▪ Working with production and process team to drive for equipment/operation improvement.
▪ Responsible in taking care Automated Test Equipment (ATE) handler.
▪ Ensure equipment operation procedures and maintenance programs are in place.
▪ Ensure equipment Preventive Maintenance practice is in place and carry out in a timely basis.
▪ Drive improvements, initiate problem solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities and higher efficiency.
▪ Ensure training and troubleshooting programs on equipment and hardware are in place.
▪ Ensure high equipment performance, maximize equipment up time. Minimize handler jam rate and improve index time.
▪ Equipment spare part management, planning.
▪ Other duties as assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Bachelor degree or above, major in Mechanical, Electrical, Electronics, Mechatronics.
▪ At least 3 years' industrial experience in equipment development or equipment maintenance experience.
▪ Familiar on ATE test equipment & Process such as Handler Pick and Place, Vision.
▪ Experienced in test equipment recipe setup and creation.
▪ Experienced in test handler maintenance.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ To provide technical expertise in maximizing overall equipment effectiveness.
▪ Lead in project management and ensure all requirements in development or improvement of equipment are met.
▪ Responsible to install, modify and maintain Wafer Sort Equipment in tip top condition.
▪ Ensure equipment operation procedures and maintenance programs are in place.
▪ Ensure equipment Preventive Maintenance practice is in place and carry out in a timely basis.
▪ Be responsible to drive equipment OEE to meet the targeted goal.
▪ Drive improvements, initiate problem solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities and higher efficiency.
▪ Ensure timely execution of new product or process development and qualification. Demonstrates discipline in timely execution of tasks.
▪ Manage/audit/liaise with suppliers and vendors to achieve quality, cost and risk management requirements. Plan and manage budgets as well as support capital planning and cost reduction initiatives.
▪ Ensure training and troubleshooting programs on equipment and hardware are in place.
▪ Ensure all requirements are met for smooth equipment implementation in production.
▪ Ensure expectations on production yield, quality, utilization and cost reduction are met consistently.
▪ Lead, train and manage a team of equipment / engineering personnel. Enable and manage engineering change control activities.
▪ Work with internal and external suppliers to develop and qualify new test solutions as well as improving product yield.
▪ Other duties as assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Bachelor degree or above, major in Mechanical, Electrical, Electronics, Mechatronics.
▪ Good knowledge of Electronic, Electrical or Mechanical Engineering.
▪ Basic understanding of semiconductor testing.
▪ Basic equipment operation and maintenance.
▪ Independent, resourceful and takes initiative.
▪ Effective communication skills.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Able to train, motivate and supervise a team of Operators to achieve quality and productivity.
▪ Able to provide technical solution to enhance equipment/tooling issue and update into equipment purchase specification.
▪ Develop and monitor equipment/tooling improvement activities and cost reduction project.
▪ Design methods and processes to achieve production target, quality, yield, output and cost goals.
▪ Leading team to do continues productivity and 5s/discipline/quality improvement through QCC/SGA team.
▪ Provide solutions to help solving line abnormal issues.
▪ Review work procedure, spec and company policy for Operators compliance.
▪ Coaching and training line personnel to improve their performance better.
▪ Liaise with line supervisor/leader for daily activity, production planning and execution.
▪ Provide guidance to Operations Specialists.
▪ Other duties assigned by supervisor.

Job Requirements:
▪ Bachelor degree or above, major in Mechanical, Electrical, Electronics, Mechatronics.
▪ Excellent oral and written skills in English.
▪ 3 to 6 years' industrial experience with more than 3 years of manufacturing operations experience.
▪ Good knowledge in SPC and Process Engineering.
▪ Basic understanding of semiconductor testing.
▪ Basic equipment operation and maintenance.
▪ Independent, resourceful and takes initiative.
▪ Effective communication skills.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:

• Operate and maintain lab equipment and processes.
• Proactively participate in quality, productivity and cost improvement projects
• Provide failure analysis support to manufacturing and engineering development teams.
• Provide effective failure analysis for customer returns, in-house monitoring failures, shipment holds, line downs, and escalated issues within a specified time frame.
• Investigate, analyze and identify root-cause of failures. Provide the potential solution to process owner or requestor to prevent future reoccurrence issue
• Perform evaluation that helps enhance area technical knowledge and improve in house Failure Analysis and Reliability capabilities.
• Develop and establish new Failure Analysis and Reliability capabilities and techniques.
• Responsible for daily lab operation tracking and updating of all failure analysis for further review and decision making.
• Responsible for Reliability Testing for qualifications, evaluation, lot release tests and measurable.
• Support production task force, perform a risk assessment for the failure to meet customer requirements.
• Analyze reliability data and test results. Update, tracking test status and publishing the reports.
• Maintaining and continue to improve reliability & failure analysis related test and operating specification documents.
• Other duties as assigned by the supervisor.

Job Requirements
• Candidate must possess at least Bachelor's Degree/Post-Graduate Diploma/Professional Degree, Master's Degree in Engineering (Electrical/Electronic), Engineering (Industrial), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent.
• At least 3 year(s) of working experience in failure analysis and reliability engineering, product engineering or characterization engineering experience.
• Preferably Senior Executive specialized in Manufacturing/Production Operations or equivalent.
• The position requires experience and demonstrated technical expertise in failure analysis and reliability field.
• Knowledge and ability to interpret results generated from Failure Analysis and Reliability testing.
• Good in communication(written and verbal) skill and ability to lead and organize giving task/ project
• Related field experience preferably in a Semiconductor or Subcon manufacturing environment.
• FA and Rel experience a plus.
• Operate and maintain lab equipment and processes.
• Proactively participate in quality, productivity and cost improvement projects
• Provide failure analysis support to manufacturing and engineering development teams.
• Provide effective failure analysis for customer returns, in-house monitoring failures, shipment holds, line downs, and escalated issues within a specified time frame.
• Investigate, analyze and identify root-cause of failures. Provide the potential solution to process owner or requestor to prevent future reoccurrence issue
• Perform evaluation that helps enhance area technical knowledge and improve in house Failure Analysis and Reliability capabilities.
• Develop and establish new Failure Analysis and Reliability capabilities and techniques.
• Responsible for daily lab operation tracking and updating of all failure analysis for further review and decision making.
• Responsible for Reliability Testing for qualifications, evaluation, lot release tests and measurable.
• Support production task force, perform a risk assessment for the failure to meet customer requirements.
• Analyze reliability data and test results. Update, tracking test status and publishing the reports.
• Maintaining and continue to improve reliability & failure analysis related test and operating specification documents.
• Other duties as assigned by the supervisor.

Job Description :
▪ Supervise and manage resources to achieve production target, quality, yield, output and cost goals.
▪ Manage the performance, motivation, and satisfaction of the production team and processes to ensure key quality, output and efficiency are met.
▪ Do shift production plan and set goal for each insertion based on weekly commitment goal.
▪ Prepare and review daily production report.
▪ Leading team to do continues productivity and 5s/discipline/quality improvement through QCC/SGA team.
▪ Solving and feedback line abnormal issues appropriately.
▪ Ensure operators to work complying spec and company policy.
▪ Coordinate to hold cross function team Tier2 meeting successfully.
▪ Rating line employees’ monthly performance fairly and encourage people do better.
▪ Coaching and training line people to improve their performance better.
▪ Other duties assigned by supervisor/manager.

Job Requirement :
▪ Candidate must possess at least a Bachelor's Degree, Post Graduate Diploma, Professional Degree, any field.
▪ At least 1 year(s) of working experience in the related field is required for this position.
▪ Applicants must be willing to work in Bayan Lepas.
▪ Preferably Junior Executives specializing in Manufacturing/Production Operations or equivalent.
▪ Full-Time position(s) available.

Other Qualifications(Plus Requirements):
▪ Computer knowledge especially on Microsoft Office Excel and Power Point.
▪ Possess leadership quality, independent and mature disposition.
▪ Good communication skills.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
• Trained and certified new hires operators / technician / cross training / add on training when requested by ATMP Operation
• Recertify operator when due for recertification
• Attend yearly recertification conducted by Engineers and must score at least 90% for all certified processes
• Prepare training material or visual aid when required
• Provide Inspection Capability Study assessment for VM operators due for recertification
• Provide One Point Lesson training for Operator when require.
• Responsible for employee training in the operation of company products.
• Plan course design and support documentation.
• Ensures training program(s) meets company and/or customer objectives.
• Maintains communication with internal and external customers to ensure effectiveness of training.
• Requires understanding of current products and applications.
• Coordinates the staffing and scheduling of in house and external training.
• Preparation for training document such as Employee training record and updating operators training status into Learning Management System
Job Requirements:
• Candidate must possess at least a Primary/Secondary School/SPM/"O" Level; or Higher Secondary/STPM/"A" Level/Pre-U; or Certificate; or Diploma, in any field.
• At least 3-5 year(s) of Trainer experience preferred or working experience in the related field is required for this position.
• Able to communicate and write in English.

Job Responsibilities:
▪ Assist NPI process engineer on the yield and process improvement activities.
▪ Support the TPM engineer on the daily and weekly product assembly yield and final yield monitoring.
▪ Support BOM creation in SAP for new product.
▪ Assist in engineering daily activities as per production / engineering demand.
▪ Participate in QCC or development activities.
▪ Work as a mentor to train /guide operators in their daily task.
▪ Identify, record, and perform first level analysis for any problem relating to product,process & quality system.
▪ Assisting in monitor equipment maintenance.
▪ Ensure related area is performing smoothly without any process / equipment relatedissues that can jeopardize the yield and quality.
▪ Participate in yield and quality improvement plans.
▪ Ensure no quality issue, ensure equipment / process accountability, lot integrity; ensure operators to work complying spec and company policy.
▪ Report abnormal line issue with escalation flow.
▪ Assist in line monitoring.
▪ Guide operators to run production equipment and perform operation according to specifications.
▪ Support supervisor to ensure correct materials/ tooling are used at the related area.
▪ Perform simple data entry and data check.
▪ Other task assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Diploma, Advanced/Higher/Graduate Diploma,
Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Others),
Engineering (Mechatronic/Electromechanical) or equivalent.
▪ Knowledge in Microsoft Office Word, Excel and power point.
▪ Understanding of semi-conductor manufacturing.
▪ Familiar with operation and maintenance of manufacturing equipment.
▪ Knowledge of equipment maintenance program.
▪ Ability to analyze, diagnose and troubleshoot equipment and hardware problems.
▪ Ability to perform process mapping.
▪ At least 1 year(s) of working experience in the related field is required for this position.
▪ Preferably Non-Executives specializing in Engineering - Electrical or equivalent.
▪ Full-Time position(s) available.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Assist NPI process engineer on the yield and process improvement activities.
▪ Support the TPM engineer on the daily and weekly product assembly yield and Final yield monitoring.
▪ Support BOM creation in SAP for new product.
▪ Assist in engineering daily activities as per production / engineering demand.
▪ Participate in QCC or development activities.
▪ Work as a mentor to train /guide operators in their daily task.
▪ Identify, record, and perform first level analysis for any problem relating to product, process & quality system.
▪ Assisting in monitor equipment maintenance.
▪ Ensure related area is performing smoothly without any process / equipment related issues that can jeopardize the yield and quality.
▪ Participate in yield and quality improvement plans.
▪ Ensure no quality issue, ensure equipment / process accountability, lot integrity; ensure operators to work complying spec and company policy.
▪ Report abnormal line issue with escalation flow.
▪ Assist in line monitoring.
▪ Guide operators to run production equipment and perform operation according to specifications.
▪ Support supervisor to ensure correct materials/ tooling are used at the related area.
▪ Perform simple data entry and data check.
▪ Other task assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Diploma, Advanced/Higher/Graduate Diploma, Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Others), Engineering (Mechatronic/Electromechanical) or equivalent.
▪ Knowledge in Microsoft Office Word, Excel and power point.
▪ Understanding of semi-conductor manufacturing.
▪ Familiar with operation and maintenance of manufacturing equipment.
▪ Knowledge of equipment maintenance program.
▪ Ability to analyze, diagnose and troubleshoot equipment and hardware problems.
▪ Ability to perform process mapping.
▪ At least 1 year(s) of working experience in the related field is required for this position.
▪ Preferably Non-Executives specializing in Engineering - Electrical or equivalent.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Responsible for the creation, edit, review, maintenance, and distribution of a company's electronic and paper documentation.
▪ To handle the retrieval of documents either as directed by employees or clients.
▪ Converting hard copies to electronic ones.
▪ Setting up document management procedures, filing, performing audits, updating and archiving documents, meeting with vendors and troubleshooting documentation issues.
▪ To ensure documentation systems meet company or outside auditing regulations.
▪ To scanning documents, copying documents, physically or electronically filing documents, organizing documents and ensuring documents are saved and safeguarded.
▪ To adhere to a retention schedule.
▪ To train employees in the proper way to create or fill out company documents.
▪ Perform other duties as required assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least Higher Secondary/STPM/"A" Level/Pre-U, Professional Certificate, Diploma/Advanced/Higher/Graduate Diploma in Computer Science/Information Technology, Business Studies/Administration/Management, Library Management or equivalent.
▪ At least 1 Year(s) of working experience in the related field is required for this position.
▪ Preferably Junior Executive specialized in Clerical/Administrative Support or equivalent.
▪ Skill : Self-starter; organizational, analytical, interpersonal, mult-tasking, speaking, and writing skills; attention to detail; experience with vendor audits and familiarity with GXP Standard Operating Procedures; knowledge of document creation and maintenance procedures, Windows OS, MS Office, SharePoint, Oracle Primavera, Adobe Acrobat, Enterprise Resource Planning, and Project Wise.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Perform failure analysis on all functional test fall outs. (PCBA).
▪ Provide feedback to line on test fallouts and quality related issues.
▪ Maintain and provide timely test/debug skillset for team.
▪ Basic analog & digital electronic debugging on assemblies & componenets.
▪ Basic soldering skills required for assembly or rework.
▪ Basic mechanical skills required for assembly/disassembly of product.
▪ Basic knowledge of electronic components (packages, polarity markings, etc).
▪ Ability to interpret schematics, BOMs, component data sheets, theory of operation, block diagram & debug guides.
▪ Ability to identify defects through visual inspection.
▪ Competence using basic tool for debug.
▪ Others duties assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Professional Certificate, Diploma, Advanced/Higher/Graduate Diploma, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
▪ Min 1 year working experiences.
▪ Fairly well accepted, good attitude and good communication skills, both written and verbal.
▪ Must be willing to do whatever is required to complete task or project on schedule and have a strong commitment to on-time performance with minimal supervision.
▪ Demonstrate a high degree of initiative and motivation and willingness to work proactively, either independently or within a team.
▪ Fresh graduates are encouraged to apply.
▪ Experienced in HVM/OSAT environment as added advantage.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Responsible for improving and sustaining the test system capability and meets the KPI like availability, OEE, and yield.
▪ Perform daily routine maintenance, verification to improve and sustain the tester availability, downtime, yield.
▪ Complete assigned tasks in a timely fashion.
▪ Adhere to system test standards, guidelines, and practices as developed for both overall group operation and individual product test efforts.
▪ Supporting engineers in improvement projects, yield and test program debugging and enhancement.
▪ Performing line troubleshooting and supporting daily production operation.
▪ Prepare daily maintenance report to effectively communicate line status to test team.
▪ Report all equipment issues within the appropriate tracking system.
▪ Participate in project reviews and department meetings as required.
▪ Adhere to all company and department policies and procedures.
▪ Others duties assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Professional Certificate, Diploma, Advanced/Higher/Graduate Diploma, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
▪ Min 1 year working experiences.
▪ Candidate with experiences on handling automated test equipment, vision calibration, tester calibration and diagnosis, pick and place adjustment, mechanical alignment and etc. will have added advantages.
▪ Fairly well accepted, good attitude and good communication skills, both written and verbal.
▪ Must be willing to do whatever is required to complete task or project on schedule and have a strong commitment to on-time performance with minimal supervision.
▪ Demonstrate a high degree of initiative and motivation and willingness to work proactively, either independently or within a team.
▪ Fresh graduates are encouraged to apply.
▪ Experienced in HVM/OSAT environment as added advantage.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Responsible for improving and sustaining the test system capability and meets the KPI like availability, OEE, and yield.
▪ Perform daily routine maintenance, verification to improve and sustain the tester availability, downtime, yield.
▪ Complete assigned tasks in a timely fashion.
▪ Adhere to system test standards, guidelines, and practices as developed for both overall group operation and individual product test efforts.
▪ Supporting engineers in improvement projects, yield and test program debugging and enhancement.
▪ Performing line troubleshooting and supporting daily production operation.
▪ Prepare daily maintenance report to effectively communicate line status to test team.
▪ Report all equipment issues within the appropriate tracking system.
▪ Participate in project reviews and department meetings as required.
▪ Adhere to all company and department policies and procedures.
▪ Others duties assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Professional Certificate, Diploma, Advanced/Higher/Graduate Diploma, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
▪ Min 1 year working experiences.
▪ Candidate with experiences in SMT, Flip Chip Attached, Reflow Oven, Single Reflow process is an added advantage.
▪ Fairly well accepted, good attitude and good communication skills, both written and verbal.
▪ Must be willing to do whatever is required to complete task or project on schedule and have a strong commitment to on-time performance with minimal supervision.
▪ Demonstrate a high degree of initiative and motivation and willingness to work proactively, either independently or within a team.
▪ Fresh graduates are encouraged to apply.
▪ Experienced in HVM/OSAT environment as added advantage.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com

Job Responsibilities:
▪ Responsible for improving and sustaining the test system capability and meets the KPI like availability, OEE, and yield.
▪ Perform daily routine maintenance, verification to improve and sustain the tester availability, downtime, yield.
▪ Complete assigned tasks in a timely fashion.
▪ Adhere to system test standards, guidelines, and practices as developed for both overall group operation and individual product test efforts.
▪ Supporting engineers in improvement projects, yield and test program debugging and enhancement.
▪ Performing line troubleshooting and supporting daily production operation.
▪ Prepare daily maintenance report to effectively communicate line status to test team.
▪ Report all equipment issues within the appropriate tracking system.
▪ Participate in project reviews and department meetings as required.
▪ Adhere to all company and department policies and procedures.
▪ Others duties assigned by supervisor.

Job Requirements:
▪ Candidate must possess at least a Professional Certificate, Diploma, Advanced/Higher/Graduate Diploma, Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
▪ Min 1 year working experiences.
▪ Candidate with experiences in Die Attach and Die Prep (Datacon Evo, Disco Sawing, Disco Laser) process is an added advantage.
▪ Fairly well accepted, good attitude and good communication skills, both written and verbal.
▪ Must be willing to do whatever is required to complete task or project on schedule and have a strong commitment to on-time performance with minimal supervision.
▪ Demonstrate a high degree of initiative and motivation and willingness to work proactively, either independently or within a team.
▪ Fresh graduates are encouraged to apply.
▪ Experience in HVM/OSAT environment as added advantage.

For career opportunity/ internship application, please send your resume and cover letter to career.penang@tf-amd.com