Die Prep Services
TF-AMD delivers complete Die Preparation services for wafers 200mm & 300mm. Die Preparation services are offered as part of our turnkey packaging and assembly process or as separate services based on customer needs.
With our advanced wafer processing equipment, TF-AMD offers expert backgrinding services for wafer-level packaging.
TF-AMD utilizes state-of-the-art equipment from Disco, Lintec, CAMTEK, MiE and DataCon to offer the following services:
Wafer Backgrinding (8" to 12" wafer diameter capability)
Dicing of Silicon SiGe wafer
Dicing of Multi Project Wafers (MPW)
Wafer map input
Die Sort or Pick & Place (A Large variety of pick tips and needle configurations to handle various customer die sorting requirements)
Tape and reel, or waffle pack outputs.