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Die Prep Services

Available Services

Overview

TF-AMD  delivers complete Die Preparation services for wafers 200mm & 300mm. Die Preparation services are offered as part of our turnkey packaging and assembly process or as separate services based on customer needs.

Capability

With our advanced wafer processing equipment, TF-AMD offers expert backgrinding services for wafer-level packaging.

 

TF-AMD utilizes state-of-the-art equipment from Disco, Lintec, CAMTEK, MiE and DataCon to offer the following services:

 

  •  Wafer Backgrinding (8" to 12" wafer diameter capability)

  •  Dicing of Silicon SiGe wafer

  •  Dicing of Multi Project Wafers (MPW)

  •  Wafer map input

  •  Die Sort or Pick & Place (A Large variety of pick tips and needle configurations to handle     various customer die sorting requirements)

  • Tape and reel, or waffle pack outputs.

(+604) 252 2000

 

Address:

TF AMD Microelectronics (Penang) Sdn. Bhd 

(formerly known as Advanced Micro Devices Export Sdn.Bhd.)

Phase III, Free Industrial Zone,

Bayan Lepas 11900, Penang, Malaysia.

 

EMAIL : inquiry@tf-amd.com

Copyright©2019 by TF AMD Microelectronics (Penang) Sdn.Bhd. All Rights Reserved.