Wafer Level Chip Scale Package
TF-AMD focused on developing innovative technologies by offering Wafer Level Chip Scale Packaging (WLCSP) which provides increased functionality, improved thermal performance and finer pitch interconnection to substrate.
In order to meet industry demands for turnkey WLCSP products, TF-AMD has offered the service from Wafer Probing and Wafer Back grind as well. TF-AMD use fully-automated wafer back grinding equipment to achieve high level of quality for post grind wafer.
The process includes wafer backgrinding, die singulation, AOI and packing in tape & Reel. WLCSP are shipped in a Tape and Reel carrier or waffle pack to hand various customer die sorting requirements. In order to deliver the high quality product to customer, TF-AMD implemented 5 site inspection and Open Short Test before Tape and Reel.