POWERING INNOVATION, SHAPING THE
FUTURE
YOUR TRUSTED PARTNER IN ADVANCED PACKAGING & TEST TECHNOLOGY EXCELLENCE

驱动创新, 开创未来 值得信赖的
先进封装与测试
技术合作伙伴

Innovate. Integrate. Elevate.

Your Trusted Partner In Advanced Packaging, Assembly And Test Technology Excellence

TF-AMD Microelectronics (Penang) Sdn. Bhd. delivers advanced packaging and test services for high-performance computing and advanced communications, empowering global customers with cutting-edge packaging solutions in a dynamic tech market.

World Leading Semiconductor OSAT

2

Sites strategically located in Bayan Lepas & Batu Kawan

200

Thousand square feet of manufacturing space

4,000

Highly skilled and dedicated employees

Our comprehensive services

Bumping & BSM

Fan Out Embedded Die Interposer

Wafer Sort

Assembly

Burn-In

Final Test

System Level Test

Back-End Inspection & Packing

Failure Analysis & Reliability Test

EXPLORE MORE . EXPLORE MORE . 

Assembly and Test Solutions Provider for Advanced Computing

Comprehensive Assembly Services

Advanced Testing Solutions

Customized Solutions

Cutting-Edge Technology

Proven Expertise

Quality Assurance

ENQUIRE NOW!
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CONTACT US NOW!

Empowering Your Business with Advanced Microelectronics Solutions. Let’s Talk